PRODUCT DESCRIPTION

LOCTITE ABLESTIK JM 7000 provides the following product

characteristics:

Technology

Cyanate Ester

Appearance

Silver

Cure

Heat cure

Filler Type

Silver

Product Benefits

●

Excellent adhesion

●

Low moisture in cavity

●

Low weight loss during cure

●

Low ionic impurities

●

High reliability

●

Minimal voiding

●

Electrically conductive

●

Thermally conductive

Application

Die attach

Substrates

Alumina, Gold plated alumina and Heat

sinks

Typical Package

Application(s)

VLSI packages, Solder sealed ceramic

packages and Solder sealed hermetic

packaging

LOCTITE ABLESTIK JM 7000 die attach adhesive has been

formulated for use in high throughput die attach applications. This

material has been used successfully on rigid substrates with die

sizes up to 700 mils.

LOCTITE ABLESTIK JM 7000 has been approved by DESC and

Rome Laboratory for military products.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, HAAKE RV-20 Rotoviscometer, mPa·s (cP):

Cone 1o @ Shear rate 22 s -1

9,000

Work Life @ 25°C, hours

8 to 16

Shelf Life @ -40°C (from date of manufacture), days

365

TYPICAL CURING PERFORMANCE

Cure Schedule

30 minutes @ 150°C

Suggested temperature cures are from 150 to 350oC. For

applications requiring higher electrical conductivity, a cure cycle of

15 minutes @ 300oC is recommended. Product properties will not

be reduced by subsequent post die attach thermal exposure, i.e.,

wirebond, and/or lid seal up to 370oC.

The above cure profiles are guideline recommendations. Cure

conditions (time and temperature) may vary based on customers'

experience and specific application requirements, as well as

customer curing equipment, oven loading and actual oven